电子封装可靠性培训

一、电子装联技术 Electronic manufacturing

●电子芯片晶元制造 Wafer fabrication

●电子元件封装 Electronic packaging

●电子元件电路板组装 Electronic component assembly

二、可靠性、质量认证及测试 Reliability、Qualification and test

●微电子器件及微系统简介Brief introduction of microelectronic devices and micro-electronic systems

●可靠性描述和浴盆曲线 Reliability description and bathtub curve

●常见可靠性模型和加速因子估算 Common reliability model and active factor estimation

●可靠性试验和认证 Typical reliability tests

●器件结构分析 Package construction analysis

三、塑料封装器件的潮气敏感性及相关问题 Moisture Sensitivity and Relevant Issues

●塑料封装器件中的水汽扩散、回流焊接过程中湿气蒸发引起的分层、爆裂等失效现象

Moisture diffusion in plastic packages, moisture induced failure modes such as delamination, popcorn crack, etc.

●器件湿气敏感性分级：JESD020:非气密性表面封装固态电路的水汽/回流敏感性等级

Moisture sensitivity level: JESD020: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

●如何判断与湿气敏感性相关的失效的根本原因：器件质量还是电子组装？

How to judge the root cause when popcorn crack happens: device quality or SMT problem?

●器件怀疑吸湿如何处理：实用指南

What to do, if your devices are susceptible of excessive moisture absorption: a practical guide

四、电子器件静电防护和过电损伤 ESD and EOS

●静放电/电过应力基本概念介绍 ESD/EOS definition and distinguish

●器件/系统静放电评估和实验方法 Component level ESD while system level ESD evaluation and test

●静放电控制和检查 Typical ESD control and checklist in manufacture process

●电过应力预防和根因分析难点 Typical EOS prevention and challenge of root cause identification

●典型案例 Case study

更多课程详情请点击咨询专属客服